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Insider: TSMC plans to build CoWoS advanced packaging line in Japan

2024-03-21

According to semiconductor industry insiders, TSMC is considering adding advanced packaging capacity in Japan. However, current planning discussions are still at an early stage and more information has not yet been revealed.

The insider said that TSMC is considering plans to introduce CoWoS advanced packaging to Japan, but the potential investment amount and specific timetable currently planned have not yet been determined.

The current development of artificial intelligence (AI) has caused a surge in global demand for advanced semiconductor packaging, stimulating chip manufacturers such as TSMC, Samsung, and Intel to increase production capacity. TSMC has previously stated that it plans to double its CoWoS production capacity this year and continue to expand in 2025.

In addition to TSMC, semiconductor OSAT companies including ASE, Powertech Technology, and KYEC are also actively expanding capital expenditures this year to deploy advanced packaging production capacity.

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